Diamond Heat Sink
Diamond Heat Sink Solutions for High Power Electronics
Ultra-high thermal conductivity up to 2200 W/m·K for semiconductor, RF, photonics, and AI hardware applications.
Maitri’s Q2 Diamonds supplies CVD diamond heat spreaders, Cu–diamond composites, and metallised substrates engineered for high heat flux and reliability-critical systems.
Datasheets, samples, and technical discussions available for OEMs, research labs, and device engineers.
- ✔ Thermal conductivity up to 2200 W/m·K
- ✔ CVD diamond, Cu–diamond & Al–diamond composites
- ✔ Custom sizes, metallisation & integration support
- ✔ Scalable manufacturing with competitive cost structure
- ✔ UK & Europe technical-commercial support via Maitri
What is a Diamond Heat Sink?
A diamond heat sink is an advanced thermal management material used to efficiently dissipate heat from high-power electronic devices. Synthetic diamond offers thermal conductivity of up to 2200 W/m·K, significantly outperforming traditional materials such as copper and aluminium.
This enables rapid heat spreading from localised hotspots, making diamond heat sinks ideal for semiconductor devices, RF systems, photonics, and high-density power electronics where thermal performance directly impacts reliability and efficiency.
Maitri’s Q2 Diamonds develops engineered solutions including CVD diamond heat spreaders, copper–diamond composites, and metallised substrates designed for integration into advanced packaging and thermal management systems.
With scalable manufacturing and custom geometry capabilities, these diamond heat sink solutions support next-generation applications requiring higher power density, reduced thermal resistance, and long-term operational stability.
Why Use Diamond Heat Sinks?
As power densities increase in modern electronic systems, conventional thermal management materials are reaching their limits.
Diamond heat sinks provide a step-change in heat dissipation performance, enabling higher efficiency, improved reliability,
and more compact system design.
Superior Thermal Conductivity
With thermal conductivity up to 2200 W/m·K, diamond heat sinks significantly outperform copper and aluminium,
enabling rapid heat spreading and reduced thermal resistance.
Manage High Heat Flux
Ideal for localised hotspots in GaN, SiC, and RF devices where conventional materials struggle to dissipate heat efficiently.
Improved Device Reliability
Lower operating temperatures reduce thermal stress, extending device lifetime and maintaining stable performance under load.
Compact System Design
Enables higher power density and smaller form factors, critical for next-generation electronics and aerospace systems.
CTE Compatibility
Diamond offers low thermal expansion, improving compatibility with semiconductor materials and reducing mechanical stress.
Engineered for Integration
Available as CVD diamond, Cu–diamond composites, and metallised substrates for seamless integration into advanced packaging.
Maitri’s Q2 Diamonds supports OEMs and research teams with scalable, application-specific diamond heat sink solutions designed to meet the demands of high-performance electronic systems.
Applications of Diamond Heat Sinks
Diamond heat sinks are deployed in high-performance systems where thermal limits directly impact efficiency, reliability, and power density.
Power Electronics (SiC / GaN)
Efficient heat dissipation in high-voltage, high-frequency devices used in EVs, renewable energy systems, and industrial converters.
RF & Microwave Systems
Critical thermal management for high-frequency amplifiers, radar systems, and satellite communication hardware.
Photonics & Laser Systems
Heat control in laser diodes and optical systems where temperature stability is critical for precision and output performance.
High-Performance Computing & AI
Thermal management for GPUs, AI accelerators, and data centre hardware operating at high power densities.
Aerospace & Defence Electronics
Reliable thermal performance in extreme environments, including avionics, radar, and space systems.
Quantum & Advanced Research
Used in experimental and next-generation systems where precise thermal control is essential.
Supporting OEMs, research labs, and system designers across the UK and Europe.
Q2 Diamond Heat Sink Solutions
Maitri’s Q2 Diamonds provides engineered diamond heat sink solutions tailored for high-performance electronic and photonic systems, supporting OEM integration and advanced packaging requirements.
CVD Diamond Heat Spreaders
High-purity synthetic diamond substrates offering maximum thermal conductivity for efficient heat spreading in semiconductor and photonics applications.
Copper–Diamond Composites
Engineered composites combining diamond’s thermal performance with copper’s mechanical and integration advantages for scalable industrial use.
Aluminium–Diamond Composites
Lightweight thermal management solutions designed for aerospace, defence, and applications requiring reduced system weight.
Metallised Diamond Substrates
Diamond substrates with tailored metallisation layers enabling direct integration into electronic packaging and device assembly.
Custom Engineering & Scalable Manufacturing
Q2 Diamonds supports custom geometries, thicknesses, and material combinations to meet specific application requirements, from prototyping to volume production.
- Custom wafer sizes and component geometries
- Tailored metallisation and bonding layers
- Integration support for semiconductor packaging
- Cost-efficient, scalable manufacturing in India
Supporting UK & Europe customers as a technical-commercial bridge between Q2 manufacturing and local application requirements.
Thermal Performance Comparison
Diamond and diamond–metal composites offer significantly enhanced thermal performance compared to conventional materials used in electronic packaging.
| Material | Thermal Conductivity (W/m·K) | CTE (ppm/K) | Key Advantage |
|---|---|---|---|
| Diamond (CVD) | 1200 – 2200 | ~1 – 2 | Maximum heat dissipation & ultra-low thermal resistance |
| Copper–Diamond (Cu–Dia) | 450 – 800 | 6 – 9 | High conductivity with CTE matching for semiconductors |
| Aluminium–Diamond (Al–Dia) | 350 – 550 | 6 – 11 | Lightweight with improved thermal stability |
| Copper | ~400 | ~16 – 17 | Good conductivity, widely used baseline |
| Aluminium | ~200 – 230 | ~23 | Lightweight, cost-effective |
| AlSiC | ~170 – 200 | ~7 – 8 | CTE-matched packaging material |
| Cu–Mo / Cu–W | ~180 – 220 | ~6 – 8 | Thermal stability & controlled expansion |
Key Insight: Diamond-based materials bridge the gap between ultra-high thermal conductivity and practical integration, offering superior performance over copper while enabling CTE compatibility with semiconductor devices.
Work with Maitri’s Q2 Diamonds in the UK & Europe
We collaborate with semiconductor companies, research institutions, and advanced packaging teams to deliver diamond-based thermal solutions tailored to real-world performance challenges.
UK & EU Technical Interface
Direct coordination with Q² India for fast technical discussions, samples, and feasibility alignment.
Custom Engineered Solutions
Tailored Cu–Diamond, Al–Diamond, and CVD diamond components designed for your application requirements.
Validation & Testing Support
Collaboration with labs and OEMs to validate performance in real operating conditions.
Scalable Manufacturing
Reliable supply from India with competitive pricing and consistent quality.
Looking to evaluate diamond for your thermal management challenges?
Discuss Your Application
71–75 Shelton Street, Covent Garden, London, United Kingdom, WC2H 9JQ
Company Registration No: 16821217
