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Polycrystalline Diamond Wafer Solutions for Semiconductor & Thermal Management Applications

Q² Diamonds supplies high-performance polycrystalline diamond wafers engineered for semiconductor, RF, photonics, quantum, and high heat flux applications.

Our synthetic CVD diamond wafers deliver ultra-high thermal conductivity, low thermal expansion, and scalable manufacturing for advanced electronic packaging and thermal management systems.

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Datasheets, technical specifications, sample availability, and application discussions for OEMs, semiconductor companies, research labs, and advanced packaging teams.

✔ Polycrystalline CVD diamond wafers up to 2200 W/m·K
✔ Custom wafer sizes, polishing, metallisation & substrate engineering
✔ For semiconductor, RF, photonics & thermal applications
✔ Scalable synthetic diamond manufacturing with competitive cost structure
✔ UK & Europe technical-commercial support via Q² Diamonds

Diamond Heat Sink Substrate for Semiconductor Cooling

What is a Polycrystalline Diamond Wafer?

A polycrystalline diamond wafer is a synthetic diamond substrate manufactured using chemical vapour deposition (CVD) technology. These diamond wafers are engineered for applications requiring exceptional thermal conductivity, thermal stability, and heat spreading performance.

Compared to conventional materials such as copper, aluminium, AlSiC, and ceramic substrates, polycrystalline diamond wafers offer significantly higher thermal conductivity — reaching up to 2200 W/m·K — while maintaining low thermal expansion and excellent material stability.

Q² Diamonds manufactures CVD polycrystalline diamond wafers for semiconductor packaging, GaN and SiC devices, RF electronics, laser systems, photonics, aerospace, quantum technologies, and advanced thermal management applications.

Custom wafer dimensions, metallisation, polishing, and engineered composite integration are available for OEMs, research institutions, and advanced electronics manufacturers across the UK and Europe.

Why Use Polycrystalline Diamond Wafers?

As semiconductor power densities continue to increase, conventional substrate and thermal management materials are reaching performance limitations. Polycrystalline diamond wafers provide superior thermal conductivity, reduced thermal resistance, and improved reliability for next-generation electronic systems.

Superior Thermal Conductivity

Improved Reliability & Reduced Thermal Stress

Low Coefficient of Thermal Expansion

Advanced Semiconductor Packaging Compatibility

Scalable Synthetic Diamond Wafer Manufacturing

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Applications of Polycrystalline Diamond Wafers

Polycrystalline diamond wafers are used in high-performance semiconductor and photonic systems where thermal limits directly impact device reliability, efficiency, and power density.

GaN & SiC Power Electronics

Diamond wafers improve thermal management in high-power GaN and SiC semiconductor devices used in EVs, renewable energy systems, RF amplifiers, and industrial converters.

RF & Microwave Packaging

Polycrystalline diamond substrates enable efficient heat spreading in radar systems, satellite communications, telecom infrastructure, and high-frequency RF electronics.

Photonics & Laser Systems

Synthetic diamond wafers provide thermal stability for laser diodes, optical systems, and photonics applications requiring precise temperature control.

AI Hardware & Data Centres

Diamond wafer substrates support high heat flux management for GPUs, AI accelerators, and next-generation computing infrastructure.

Quantum & Research Applications

Used in advanced research environments where thermal conductivity, stability, and material performance are critical.

Supporting OEMs, research labs, and system designers across the UK and Europe.

Q^² Polycrystalline Diamond Wafer Solutions

Q² Diamonds manufactures synthetic polycrystalline diamond wafers and engineered diamond thermal management materials for semiconductor, photonics, RF, aerospace, and advanced packaging applications.

CVD Polycrystalline Diamond Wafers

High thermal conductivity synthetic diamond wafers engineered for semiconductor cooling, heat spreading, and advanced electronic packaging.

Metallised Diamond Substrates

Custom metallisation and bonding layers designed for integration into RF, photonics, and semiconductor assemblies.

Copper–Diamond Composite Materials

Engineered Cu–Diamond composites combining thermal performance with scalable manufacturing and integration flexibility.

Custom Diamond Wafer Manufacturing

Tailored wafer dimensions, polishing, thicknesses, and substrate engineering for OEM and research requirements.

Material	Thermal Conductivity (W/m·K)	CTE (ppm/K)	Key Advantage
Polycrystalline Diamond Wafer (CVD)	1200 – 2200	~1 – 2	Ultra-high thermal conductivity with extremely low thermal expansion for advanced semiconductor and photonics applications
Single Crystal Diamond	~1800 – 2500	~1	Exceptional thermal performance for specialised high-end optical and quantum applications
Copper–Diamond Composite (Cu–Diamond)	450 – 800	6 – 9	High thermal conductivity with improved semiconductor CTE compatibility
Aluminium–Diamond Composite (Al–Diamond)	350 – 550	6 – 11	Lightweight thermal management material for aerospace and defence systems
Copper	~400	~16 – 17	Widely used thermal management baseline material
Aluminium	~200 – 230	~23	Low-cost lightweight thermal solution
AlSiC	~170 – 200	~7 – 8	CTE-matched packaging material for power electronics
Cu–Mo / Cu–W	~180 – 220	~6 – 8	Controlled thermal expansion and mechanical stability
Aluminium Nitride (AlN)	~140 – 180	~4 – 5	Common ceramic substrate for electronic packaging
Beryllium Oxide (BeO)	~200 – 330	~7 – 8	High thermal conductivity ceramic substrate

Material

Thermal Conductivity (W/m·K)

CTE (ppm/K)

Key Advantage

Polycrystalline Diamond Wafer (CVD)

1200 – 2200

~1 – 2

Ultra-high thermal conductivity with extremely low thermal expansion for advanced semiconductor and photonics applications

Single Crystal Diamond

~1800 – 2500

Exceptional thermal performance for specialised high-end optical and quantum applications

Copper–Diamond Composite (Cu–Diamond)

450 – 800

6 – 9

High thermal conductivity with improved semiconductor CTE compatibility

Aluminium–Diamond Composite (Al–Diamond)

350 – 550

6 – 11

Lightweight thermal management material for aerospace and defence systems

Copper

~400

~16 – 17

Widely used thermal management baseline material

Aluminium

~200 – 230

~23

Low-cost lightweight thermal solution

AlSiC

~170 – 200

~7 – 8

CTE-matched packaging material for power electronics

Cu–Mo / Cu–W

~180 – 220

~6 – 8

Controlled thermal expansion and mechanical stability

Aluminium Nitride (AlN)

~140 – 180

~4 – 5

Common ceramic substrate for electronic packaging

Beryllium Oxide (BeO)

~200 – 330

~7 – 8

High thermal conductivity ceramic substrate

Polycrystalline Diamond Wafer FAQs

What is a polycrystalline diamond wafer used for?

Polycrystalline diamond wafers are used in semiconductor, RF, photonics, aerospace, quantum, and thermal management applications requiring ultra-high thermal conductivity and low thermal resistance.

What is the thermal conductivity of a CVD diamond wafer?

CVD polycrystalline diamond wafers can achieve thermal conductivity up to approximately 2200 W/m·K, significantly higher than copper or aluminium.

Can Q² Diamonds supply custom diamond wafer sizes?

Yes. Q² Diamonds supports custom wafer dimensions, thicknesses, polishing, metallisation, and engineered composite solutions for OEM and research applications.

Do you supply polycrystalline diamond wafers in the UK and Europe?

Yes. Maitri’s Q² Diamonds supports customers across the UK and Europe with technical-commercial coordination, samples, and application discussions.